Metal Substrate
Aluminum/Copper-based metal core substrates offer excellent thermal conductivity and electrical insulation, ideal for high heat dissipation applications such as LED lighting and power modules.
Technical Specifications
| substrate | Aluminum-based, Copper-based |
| Thermal conductivity | 1.0-3.0 W/(m·K) |
| Layers | 1-2 Layer |
| Minimum Line Width/Spacing | 4mil/4mil |
| Plate Thickness | 0.8-6.0mm |
| Surface Finish | Immersion Gold, Hot Air Solder Leveling (HASL), Organic Solderability Preservative (OSP) |
| Copper Thickness | 1OZ-4OZ |
| Withstand Voltage | 1500V-3000V |
Application Areas
LED lightingPower ModuleHeadlightsIndustrial Variable Frequency Drive
Quality Certification
ISO 9001UL CertificationCE Certification
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